发明名称 INSULATING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To improve an insulation-resistance of an insulating circuit board as well as an internal-insulating type semiconductor device using it. SOLUTION: The thickness of a conductor terminal of an insulating circuit board is 10μm or larger. The contact angle between a joint material and an insulating substrate is set to 90 deg. or larger, or a tip end is a ball of radius 5μm or larger. The width of protrusion at a terminal side is 10μm or larger in a plane. Since the electric field concentration of the insulating circuit board is suppressed, an insulation resistance is improved.</p>
申请公布号 JP2001102521(A) 申请公布日期 2001.04.13
申请号 JP19990275721 申请日期 1999.09.29
申请人 HITACHI LTD;HITACHI ENGINEERING CONSULTING KK 发明人 KOIKE YOSHIHIKO;SHIMIZU HIDEO;KUSHIMA TADAO;TANAKA AKIRA;SAITO RYUICHI;NONOYAMA SHIGEHARU;KARIYA TADAAKI;KAMATA YUZURU
分类号 H05K1/02;H01L23/12;H01L25/07;H01L25/18;(IPC1-7):H01L25/07 主分类号 H05K1/02
代理机构 代理人
主权项
地址