发明名称 |
INSULATING CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve an insulation-resistance of an insulating circuit board as well as an internal-insulating type semiconductor device using it. SOLUTION: The thickness of a conductor terminal of an insulating circuit board is 10μm or larger. The contact angle between a joint material and an insulating substrate is set to 90 deg. or larger, or a tip end is a ball of radius 5μm or larger. The width of protrusion at a terminal side is 10μm or larger in a plane. Since the electric field concentration of the insulating circuit board is suppressed, an insulation resistance is improved.</p> |
申请公布号 |
JP2001102521(A) |
申请公布日期 |
2001.04.13 |
申请号 |
JP19990275721 |
申请日期 |
1999.09.29 |
申请人 |
HITACHI LTD;HITACHI ENGINEERING CONSULTING KK |
发明人 |
KOIKE YOSHIHIKO;SHIMIZU HIDEO;KUSHIMA TADAO;TANAKA AKIRA;SAITO RYUICHI;NONOYAMA SHIGEHARU;KARIYA TADAAKI;KAMATA YUZURU |
分类号 |
H05K1/02;H01L23/12;H01L25/07;H01L25/18;(IPC1-7):H01L25/07 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|