| 摘要 |
PROBLEM TO BE SOLVED: To uniformize height of bumps, while shortening the time required for the formation of the bumps. SOLUTION: A multilayer plate 10, formed by attaching a conductor foil 12 having thickness corresponding to the height of a bump 18 onto an insulator substrate 11, is used as a printed wiring board. A resist layer 17 is formed on the conductor foil 12 and then removed except the bump forming regions. Subsequently, the multilayer plate 10 is etched, thus removing the conductor foil except the bump forming regions. Finally, the resist layer 17 is removed from the bump forming regions, thus forming bumps 18 having a height determined by the thickness of the conductor foil 12.
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