发明名称 OXIDE SUPERCONDUCTING LAMINATED-SUBSTRATE AND MANUFACTURING METHOD THEREFOR AND MANUFACTURING METHOD FOR SUPERCONDUCTING INTEGRATED CIRCUIT
摘要 PROBLEM TO BE SOLVED: To provide an oxide superconducting crystalline substrate or a dielectric substrate used as substrate for electronic device, which is provided with an insulating film and a conductive film for circuit, having high flatness and high crystallinity, and to perform at least one of the followings: to avoid cracks on the oxide superconducting crystalline substrate due to a heat treatment performed during the formation of the insulating film and the conductive film and to enable connections between electrodes and wires provided on the upper and lower sides of substrates easily. SOLUTION: An oxide superconducting laminated substrate 1 comprises an oxide superconducting crystalline substrate 3 with a high flatness and a high crystallinity and a reinforcing crystalline substrate 1 with high strength, wherein the substrate 3 is bonded to the substrate 1 through a thermal application.
申请公布号 JP2001101930(A) 申请公布日期 2001.04.13
申请号 JP19990277616 申请日期 1999.09.29
申请人 INT SUPERCONDUCTIVITY TECH;ISHIKAWAJIMA HARIMA HEAVY IND;FUJITSU LTD;SUMITOMO ELECTRIC INDUSTRIES 发明人 IZUMI TERUO;KOYAMA SATOSHI;SHIOBARA TORU;TANAKA SHOJI;ENOMOTO YOICHI;EGAMI MASAHIRO;SUZUKI HIDEO;IIYAMA MICHITOMO
分类号 H01B5/14;H01L39/02;H01L39/24;(IPC1-7):H01B5/14 主分类号 H01B5/14
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