| 摘要 |
<p>A semiconductor device which includes a board (10). The board (10) is formed with a wiring pattern (12) and has a first portion (14), and a second portion (16) to be flatwise placed on the first portion (14). The first portion (14) has sides (22, 24, 26, 28) serving as criteria for positioning, while the second portion (16) is shaped to be placed on the first portion (14) while avoiding the sides (22, 24, 26, 28) of the first portion (14).</p> |
