A heat exchanger (17) for an electronic heat pump (11) includes a thermally conductive base plate (18) having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins (21). The adjacent fins (21) define there between a plurality of micro channels.
申请公布号
WO0125711(A1)
申请公布日期
2001.04.12
申请号
WO2000AU01220
申请日期
2000.10.06
申请人
HYDROCOOL PTY LIMITED;BATCHELOR, ANDREW, W.;BANNEY, BEN;MCDONALD, DAVID;CHANDRATILLEKE, TILAK, T.
发明人
BATCHELOR, ANDREW, W.;BANNEY, BEN;MCDONALD, DAVID;CHANDRATILLEKE, TILAK, T.