Cutting a workpiece, e.g. a semiconductor wafer comprises a cutting step and a whisker removal step

摘要

Process for cutting a workpiece comprises a cutting step in which the workpiece moves in a forward direction relative to the rotation of the cutting blade at a position where the blade and the workpiece are directed towards each other; and a whisker removal step in which the groove cut by the cutting step is pulled. Preferred Features: The two steps are carried out by moving the workpiece back and forth relative to the cutting blade.