Method for integration of integrated circuit devices

摘要

A method for integration of integrated circuit devices includes providing an array of first devices including dummy devices on a first chip; providing an array of contacts on a second chip; flip-chip bonding the first device to the contacts; filing the voids between the two interstitially of the first devices with an underfill; masking the first devices leaving exposed selected dummy devices; removing the dummy devices leaving an array of holes with contacts; providing a spaced array of second devices on a third chip matching the array of holes; flip-chip bonding the second devices to the contacts in the holes; and filling the voids between the chips associated with second devices with an underfill.