| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing a board covered with a thin plate, the unevenness on the surface developing in a product to be formed at pasting the thin plate to the board, the unevenness of the thickness of which is inevitable, is removed as much as possible. SOLUTION: Under the condition that the planeness of a thin plate 3 on the side contacting a surface plate 2 by bringing the thin plate in the tight contact with and onto the surface plate 2 under the state that the surface plate 2 with an elevated planeness is fixed with an air chuck in a rotary part, is ensured, a board 5 is placed on the thin plate 3 through an adhesive 4 on the opposite side of the thin plate 3 and then the fixing stand of the thin plate 3 is rotated so as to remove the excess portion of the adhesive 4 and further the conveyance such as the supplying, delivering and housing of the thin plate 3 and the board is performed mechanically with a robot, resulting in obtaining a product, the planeness of the surface of which is excellent.
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