EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR AND PHOTOSEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for a photosemiconductor having high transparency and continuous moldability. SOLUTION: This epoxy resin composition for photosemiconductor comprises an epoxy resin as essential components, a curing agent, a curing promoter and a mold release agent. The epoxy resin composition is compounded with a compound of the formula (l is 1-50; m is 1-100; n is 1-100) as the mold release agent. The total of the addition ratio of propylene oxide and that of ethylene oxide in the mold release agent of the formula is in the range of 40-90% of the molecular weight. The amount of the mold release agent of the formula in the epoxy resin composition is set 0.1-5 wt.% the total of the essential components. Consequently the composition can have excellent transparency and mold release characteristics and improved continuous moldability.