| 摘要 |
PROBLEM TO BE SOLVED: To perform a solder-applying work for a work with melting solder contained in a solder tank, with speed and sure. SOLUTION: An ultrasonic solder application device 10 containing melted solder is provided with a solder tank 11 in which ultrasonic vibrators 12 and 13 are placed, and a transporting chain 15 placed on the solder tank 11 in which holding jigs 16 for holding a work W are fitted at fixed pitches. A first reciprocating unit 18 is provided on an inlet port side of the solder tank 11 in parallel with the transporting chain 15, and a second reciprocating unit 22 is provided on an outlet port side of the solder tank 11 in parallel with the transporting chain 15. The first reciprocating unit 18 and the second reciprocating unit 22 move synchronously with the transporting chain 15 at reciprocation, and the work W of the first reciprocating unit 18 is surely transferred to the holding jig 16 of the transporting chain 15, and further the work W of the holding jig 16 is received with the second reciprocating unit 22 with sure. |
