发明名称 APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing electronic components which is improved in effective floor area ratio, etc. SOLUTION: This apparatus has a transport machine, which moves on a rail disposed at the ceiling, puts cassettes 5 in a cassette container 8 and transports it to carry in/out chamber 6, and a means 9 disposed in the carry in/out chamber 6 for lifting the cassettes 5 carried with the cassette container 8, and comprises a transporting means for taking only one of substrates 1 horizontally from the cassette 5 at an approximately fixed horizontal position and transferring it out to a load lock chamber 3.
申请公布号 JP2001093957(A) 申请公布日期 2001.04.06
申请号 JP19990267315 申请日期 1999.09.21
申请人 SHARP CORP;OMI TADAHIRO 发明人 TAGUSA YASUNOBU;HIRAYAMA MASAKI;OMI TADAHIRO
分类号 B65G1/00;H01L21/673;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B65G1/00
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