| 摘要 |
PURPOSE: A power device having a multi-chip package structure is provided to secure a sufficient insulating property between two chips mounted on a single chip pad, to simplify a manufacturing process, and to reduce a size of the package. CONSTITUTION: The power device includes two chips such as a switching device and a control IC mounted onto the single chip pad of a lead frame. A conductive adhesive such as a solder is used for mounting of one chip such as the switching device, whereas an adhesive tape is used for the other chip such as the control IC. The adhesive tape has an adhesive property under a melting temperature of the solder adhesive. Bond pads of both chips are electrically connected to each other by the first gold wires, and connected to inner leads of the lead frame by the second gold wires. The both chips and the gold wires are embedded in a mold body. |
