| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the assembling of a chip to a substrate as a pellet 151 constituted, by integrally forming a semiconductor laser element part 51a and a light-receiving element part 51b for monitoring the output of the laser element part and at the same time, so as to enable confirmation of the characteristics of each pellet in the state of a wafer prior to divide the wafer into each pellet 151. SOLUTION: A semiconductor laser pellet 151, formed by integrally forming a distributed feedback semiconductor laser element part 51a provided with an optical path part 51 formed by lamination-forming a plurality of semiconductor films and a light-receiving element part 51b constituted by using the plurality of the semiconductor films in common with the element part 51a, in such a way as to extend the optical path part 51 of the element part 51a on the same semiconductor substrate 50 is used as a chip.
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