发明名称 METHOD OF FORMING EXPOSED CIRCUIT PATTERNS OF PRINTED CIRCUIT BOARD(PCB)
摘要 PURPOSE: A method of forming exposed circuit patterns of a printed circuit board(PCB) is provided to simplify the forming operation and increase the precision simultaneously and enable an integrated or small PCB. CONSTITUTION: In a method of forming exposed circuit patterns, circuit patterns are formed on a board(21). Solder resist(25) is applied on a board(21) formed with circuit patterns(22). The solder resist(25) is hardened as insulation. Certain parts of the solder resist(25) are eliminated selectively by laser(L) projected until the circuit patterns are exposed, accomplishing a solder land(30). By using a laser(L), errors can be reduced noticeably and thus manufacturing steps can be streamlined. And the PCB can be reduced in size as the pitch(P) between the solder land (30) and the circuit pattern(22) is reduced.
申请公布号 KR20010028496(A) 申请公布日期 2001.04.06
申请号 KR19990040765 申请日期 1999.09.21
申请人 LG ELECTRONICS INC. 发明人 JANG, YONG SUN;JIN, WON HYEOK;LEE, SEONG GYU
分类号 H05K3/02;H05K3/00;H05K3/28;(IPC1-7):H05K3/02 主分类号 H05K3/02
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