发明名称 APPARATUS FOR RAPIDLY HEATING SEMICONDUCTOR WAFER
摘要 PURPOSE: An apparatus for rapidly heating a semiconductor wafer is provided to prevent a fine crack of the wafer, by uniformly heating the wafer by a lamp while injected gas passes through a gas distributing plate and a uniform gas flow is performed on the wafer. CONSTITUTION: A plurality of lamps are installed in an outer portion of a tube(12). A wafer tray(15) for loading/unloading a wafer(14) is installed in an inner portion of the tube. A wafer revolving unit is installed in an end portion of the wafer tray. The wafer revolving unit can be a turntable(22) having a motor(21).
申请公布号 KR20010027101(A) 申请公布日期 2001.04.06
申请号 KR19990038684 申请日期 1999.09.10
申请人 HYUNDAI MICRO ELECTRONICS CO., LTD. 发明人 SHIN, SEONG CHEOL
分类号 H01L21/324;(IPC1-7):H01L21/324 主分类号 H01L21/324
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