发明名称 |
APPARATUS FOR RAPIDLY HEATING SEMICONDUCTOR WAFER |
摘要 |
PURPOSE: An apparatus for rapidly heating a semiconductor wafer is provided to prevent a fine crack of the wafer, by uniformly heating the wafer by a lamp while injected gas passes through a gas distributing plate and a uniform gas flow is performed on the wafer. CONSTITUTION: A plurality of lamps are installed in an outer portion of a tube(12). A wafer tray(15) for loading/unloading a wafer(14) is installed in an inner portion of the tube. A wafer revolving unit is installed in an end portion of the wafer tray. The wafer revolving unit can be a turntable(22) having a motor(21).
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申请公布号 |
KR20010027101(A) |
申请公布日期 |
2001.04.06 |
申请号 |
KR19990038684 |
申请日期 |
1999.09.10 |
申请人 |
HYUNDAI MICRO ELECTRONICS CO., LTD. |
发明人 |
SHIN, SEONG CHEOL |
分类号 |
H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/324 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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