| 摘要 |
PURPOSE: A semiconductor stack package and a manufacturing method thereof using flip chip bonding technique are provided to allow a reduction in thickness of the package. CONSTITUTION: The package includes two chips(22,24) and a substrate(21) having a cavity(A) centrally formed thereon. The first chip(22) is attached to the first bumps(23) preformed in the cavity(A). The cavity(A) is then filled with a resin encapsulant sealing the first chip(22). Thereafter, the second bumps(23a) are formed on the substrate(21) out of the cavity(A), and the second chip(24) is attached to the second bumps(23a). A mold body(26) is then formed on the substrate(21), covering the second chip(24). Next, pluralities of solder balls(25) are formed under the substrate(21).
|
