发明名称 HEAT TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat treating device to rapidly cool heated engineering plastic to temperature having a temperature difference of 100 deg.C or higher. SOLUTION: Engineering plastic is carried to a preheating chamber 12 to perform preheating, to a first thermal treatment chamber 14 to heat it to 360 deg.C for drawing, and to a second thermal treatment chamber 18 to thermally fix at 200 deg.C. In buffering chamber 61, hot air of 360 deg.C flows in through upper and lower nozzles 42a and 44b of the first thermal treatment chamber 14 and hot air of 200 deg.C through upper and lower nozzles 60a and 62a of the second thermal treatment chamber 18. The internal temperature of the buffering chamber 16 is 360 deg.C on the first heat treatment chamber 14 side, and temperature is gradually decreased therefrom and to 200 deg.C in the vicinity of the second thermal treatment chamber 18. The temperature is smoothly reduced and engineering plastic passing through the buffering chamber 16 is gradually cooled.
申请公布号 JP2001091162(A) 申请公布日期 2001.04.06
申请号 JP19990265565 申请日期 1999.09.20
申请人 HIRANO TECSEED CO LTD 发明人 YAMANO TAKAO;KAWAMURA HIROSHI
分类号 B29C35/04;F27B9/02;F27B9/10;F27B9/28;F27B9/36;(IPC1-7):F27B9/02 主分类号 B29C35/04
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