SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A substrate for a semiconductor package and a method for manufacturing the semiconductor package using the substrate are provided to allow a simultaneous manufacture of several dozens to hundreds of ultra thin packages and further to minimize the warpage of the substrate. CONSTITUTION: The substrate(100) includes a resin layer(6) in which a main-strip(4) is formed by a plurality of sub-strips(2) arranged in a row and each sub-strip(2) is formed by a plurality of through holes(8) arranged in a matrix form. On an upper surface of the resin layer(6), conductive circuit patterns including bond fingers(12) and ball lands(14) are formed around the through holes(8). The resin layer(6) and the circuit patterns are covered with a cover coat(16) except the bond fingers(12) and the ball lands(14). In addition, separate cover lay tapes are respectively attached to the sub-strips(2) of the substrate(100), allowing the minimized warpage of the substrate(100) and a simplified removal of the cover layer tapes.