METHOD FOR FORMATION OF WIRING PATTERN, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME, CIRCUIT BOARD, AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a method for forming wiring pattern by which rewiring can be made without implementing a full-surface thin film forming step (sputtering) or etching step, a semiconductor device and a method for manufacturing it, a circuit board, and electronic equipment. SOLUTION: A method for forming wiring pattern includes a first step of providing a catalyst 60 in an exposed state in the forming area of a wiring pattern and a second step of forming the wiring pattern with a conductive material 30 by performing electroless plating for depositing the material 30 on the exposed area of the catalyst 60.