| 摘要 |
PROBLEM TO BE SOLVED: To obtain a photo-soldering resist resin composition excellent in resistance to electroless gold plating. SOLUTION: The photo-soldering resist resin composition for electroless gold plating contains (A) one or more nitrogen-containing compounds selected from the group comprising imidazole, pyrazole, thiazole, dithiazole, triazole, tetrazole and their derivatives, (B) an unsaturated resin containing a carboxy group and, optionally, a hydroxy group, (C) a photopolymerization initiator and (D) one or more curing agents selected from a curing agent having a functional group which reacts with the carboxy group in the resin B and a curing agent having a functional group which reacts with the hydroxy group optionally contained in the resin B. |
