发明名称 METHOD FOR FORMING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method for forming patterns by which the formation of an organic silicon mask retaining a masking property to a film to be processed without being deteriorated is made possible. SOLUTION: This method includes a stage for forming resist patterns on a substrate to be processed, a stage for embedding an organic silicon compound having the bond of silicon and silicon in the main chain into the apertures of the resist patterns, a stage for heating the resist patterns above a temperature at which the dissolution suppressing group or dissolution suppressing agent in the resist decomposes and a stage for forming the organic silicon film patterns by immersing the resist patterns into a solution which dissolves the resist and removing the resist patterns.
申请公布号 JP2001092154(A) 申请公布日期 2001.04.06
申请号 JP19990271256 申请日期 1999.09.24
申请人 TOSHIBA CORP 发明人 SHIOBARA HIDESHI;SATO YASUHIKO;ASANO MASASHI;MITSUYOSHI YASURO
分类号 H01L21/306;G03F7/40;G03F7/42;H01L21/027;H01L21/312;(IPC1-7):G03F7/40 主分类号 H01L21/306
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