发明名称 |
METHOD FOR FORMING PATTERN |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming patterns by which the formation of an organic silicon mask retaining a masking property to a film to be processed without being deteriorated is made possible. SOLUTION: This method includes a stage for forming resist patterns on a substrate to be processed, a stage for embedding an organic silicon compound having the bond of silicon and silicon in the main chain into the apertures of the resist patterns, a stage for heating the resist patterns above a temperature at which the dissolution suppressing group or dissolution suppressing agent in the resist decomposes and a stage for forming the organic silicon film patterns by immersing the resist patterns into a solution which dissolves the resist and removing the resist patterns. |
申请公布号 |
JP2001092154(A) |
申请公布日期 |
2001.04.06 |
申请号 |
JP19990271256 |
申请日期 |
1999.09.24 |
申请人 |
TOSHIBA CORP |
发明人 |
SHIOBARA HIDESHI;SATO YASUHIKO;ASANO MASASHI;MITSUYOSHI YASURO |
分类号 |
H01L21/306;G03F7/40;G03F7/42;H01L21/027;H01L21/312;(IPC1-7):G03F7/40 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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