发明名称 TAPE ATTACHING APPARATUS FOR FINE PITCH BALL GRID ARRAY PACKAGE
摘要 PURPOSE: A tape attaching apparatus for a fine pitch ball grid array package is provided to guarantee a flat surface of the substrate tape being fixed onto a tape carrier with an adhesive tape. CONSTITUTION: The apparatus includes a carrier mounting stage(51) on which the tape carrier(20) is mounted, and a roller(55) for performing a rolling operation and applying a pressure onto the adhesive tape(40) affixing the substrate tape(30) to the underlying tape carrier(20). In addition, a pair of projections(52) is formed longitudinally on peripheries of the carrier mounting stage(51) to support both lower surface edges of the tape carrier(20). Also, pressing members(53) are formed between the projections(52) to press respective middle portions of both shorter side edges of the tape carrier(20). Therefore, the tape carrier(20) is downward bent a little at the middle portions by the pressing members(53) while the adhesive tape(40) is attached to the substrate tape(30) and the tape carrier(20). Thereafter, when the pressing members(53) are released, the tape carrier(20) is spread out and thereby the substrate tape(30) affixed thereto is tightened and flatted.
申请公布号 KR20010027646(A) 申请公布日期 2001.04.06
申请号 KR19990039485 申请日期 1999.09.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, DONG BIN;KIM, YUN SIK;SUN, YONG GYUN
分类号 H01L23/28;(IPC1-7):H01L23/28 主分类号 H01L23/28
代理机构 代理人
主权项
地址