| 摘要 |
<p>A method of bonding ceramic members together and an insert material for heat-bonding used therein. In this method, ceramic members to be bonded together are subjected to dielectric heating in a state in which a heating ceramic material having a dielectric constant greater than that of the ceramic members is interposed therebetween. In such dielectric heating, mainly the heating ceramic having a higher dielectric constant is heated and a temperature of butting parts of the material and members is raised to a sufficient degree for bonding. In this bonding operation, the application of pressure to butting parts is preferable, however, not always necessary. When no pressure is applied, layers of bonding agent are preferably formed on the butting surfaces of the heat-bonding insert beforehand.</p> |
