| 发明名称 |
Semiconductor device provided with semiconductor chip, has semiconductor circuit and circuit elements respectively formed on front and back surface of semiconductor chip |
| 摘要 |
Semiconductor circuit (2) is formed on front surface (3) of semiconductor chip (1). The circuit elements such as capacitor and inductor are formed on the back surface (4) of semiconductor chip.
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| 申请公布号 |
DE10021344(A1) |
申请公布日期 |
2001.04.05 |
| 申请号 |
DE2000121344 |
申请日期 |
2000.05.02 |
| 申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
FUKUDA, KAZUYOSHI |
| 分类号 |
H01L21/822;H01F17/00;H01L23/52;H01L23/522;H01L27/04;H01L27/06;(IPC1-7):H01L27/08;H01L25/065;H01F17/02;H01G4/33 |
主分类号 |
H01L21/822 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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