Method of recovering or reworking electrostatic retaining devices, such as E-chucks for semiconductor wafer processing, involves removing foil system from electrostatic retainer

摘要

Electrostatic wafer-retaining systems comprise of a conductor glued between plastic foils; the foil systems limit the working life of the E-chuck, and the price of which is set largely by the manufacturing costs for the basic body (pedestal). Removal of the foil system from an electrostatic retaining system consisting of a basic body (pedestal) and a true electrostatic retaining system glued to it, which consists of a lower or bottom foil glued onto the pedestal, a conductor and an upper covering foil, involves initially macerating the adhesive in a polar organic solvent. The macerated adhesive is then completely or mainly mechanically removed, without the danger of damaging the pedestal.