ADHESIVE CONDUCTOR AND CHIP MOUNTING STRUCTURE USING IT

摘要

PURPOSE: An adhesive conductor is provided to connect electrically between elements mounted on the adjacent layers. A chip mounting structure is provided to prevent the thermal mismatch. CONSTITUTION: The adhesive conductor(10) comprises an adhesive layer(20) and a conductive wire(30). The adhesive layer absorbs the thermal shock produced by a thermal expansion coefficient. The conductive wire provides an electrical connection between the adjacent layers by penetrating the layers. The adhesive layer is a silicon rubber adhesive. The chip mounting structure comprises a printed circuit board(PCB), a plurality of chips mounted on the PCB, and an adhesive conductor.