POLYAMIDE-CONTAINING LIGANDS COVALENTLY BONDED TO SUPPORTS, POLYAMIDE-CONTAINING RESINS, AND METHODS FOR REMOVING METALS FROM SOLUTIONS

摘要

Compositions and methods for selectively binding metal ions from source solutions are disclosed. The compositions include 1) polyamide-containing ligands covalently bonded to a particulate solid support, and 2) polyamide-containing polymeric resins. In the case of the ligand bonded to the solid support, the ligand is bounded or tethered to the solid support through a hydrophilic spacer such that the overall formula is SS-A-X-L. In this formula, SS is a particulate solid support such as silica or a polymeric bead, A is a covalent linkage mechanism, X is a hydrophilic spacer grouping, and L is a polyamide-containing ligand having three or more amide groups and two or more amine nitrogens separated by at least two carbons with the proviso that when SS is a particulate organic polymer, A-X may be combined as a single covalent linkage. With respect to the polyamide ligand-containing polymeric resin, this composition is a reaction product of a hydroxymethylated polyamide ligand and a polymerization and/or crosslinking agent.