| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive and highly reliable ceramic circuit board provided with an Al circuit sheet. SOLUTION: This brazing filler metal consists of an Al alloy containing 0.1-10 wt.% Sn and 0-5 wt.% Mg, and preferably, further contains at least one element selected from Si, Cu and Ge and is used for joining a ceramic substrate and a metal sheet consisting essentially of aluminum, together. This ceramic circuit board is manufactured by using the brazing filler metal.
|
