摘要 |
A method of repairing or augmenting a metal line buried beneath at least one cover layer comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via. Also provided is apparatus for repairing or augmenting a metal line buried beneath at least one cover layer comprising means for creating a via through the cover layer to the metal line, means for repairing or augmenting the metal line, and means for filling the via. Also provided is a substrate having a metal line buried beneath at least one cover layer wherein the metal line has been repaired or augmented according to the process comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via.
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