发明名称 Repair of dielectric-coated electrode or circuit defects
摘要 A method of repairing or augmenting a metal line buried beneath at least one cover layer comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via. Also provided is apparatus for repairing or augmenting a metal line buried beneath at least one cover layer comprising means for creating a via through the cover layer to the metal line, means for repairing or augmenting the metal line, and means for filling the via. Also provided is a substrate having a metal line buried beneath at least one cover layer wherein the metal line has been repaired or augmented according to the process comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via.
申请公布号 US6211080(B1) 申请公布日期 2001.04.03
申请号 US19960741480 申请日期 1996.10.30
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 TATAH ABDELKRIM
分类号 C23C14/00;B23K26/00;C23C14/04;C23C16/04;H05K1/03;H05K1/11;H05K3/00;H05K3/14;H05K3/22;H05K3/28;H05K3/34;H05K3/46;(IPC1-7):H01L21/44 主分类号 C23C14/00
代理机构 代理人
主权项
地址