发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin composition excellent in resolving power, developer resistance, sandblast resistance, etc. SOLUTION: This pbotosensitive resin composition contains a carboxyl- containing urethane acrylic resin (A) obtained by reacting a carboxyl-containing diol compound and a diol compound having an average molecular weight of <=500 and no acid value with a polyisocyanate compound and reacting the resulting urethane compound with a compound having one or more ethylenically unsaturated groups and one hydroxyl group, a photopolymerization initiator (B) and an acrylic polymer (C) containing >=50 wt.% hydroxyl-containing monofunctional monomer and having <=50 mgKOH/g acid value. Preferably the composition further contains an alkyl (meth)acrylate (D).
申请公布号 JP2001083699(A) 申请公布日期 2001.03.30
申请号 JP19990256518 申请日期 1999.09.10
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 SATO HIROAKI
分类号 G03F7/027;C08F2/44;C08F2/50;C08F299/06;C08L33/08;C08L75/16;G03F7/004;G03F7/028;G03F7/033;H01J11/22;H01J11/34;H01J11/36 主分类号 G03F7/027
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