SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To surely support a bump electrode arranged outside a chip by enhancing reflow resistance in a fan-in/out type of semiconductor device. SOLUTION: This semiconductor device 11 comprises a porous elastomer 3, which is made on the main face 1a of a semiconductor chip 1 and in which an opening 3c for exposing an electrode pad 1b of the semiconductor chip 1 is made, a tape substrate 4 which extends outward the chip from on the main face 1a of the semiconductor chip 1 and whose one end is connected electrically with an electrode pad 1b and whose other end is connected electrically with a bump electrode 2 and in which an opening 4e to expose the electrode pad 1b is made, a frame-shaped reinforcing member 5 which reinforces the support of the bump electrode 2 arranged outside the semiconductor chip 1, and a sealing part 5 which seals the electrode pad 1b of the semiconductor chip 1 and a lead 4c, and the support by the tape substrate 4 of the bump electrode 2 arranged outside the semiconductor chip 1 is reinforced by the reinforcing member 6.