| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device using a laminated type thin package superior in elasticity and heat dissipation. SOLUTION: A plurality of wiring boards 30 having a plurality of connection electrodes buried in vias and wirings 8 electrically connected to the connection electrodes, semiconductor elements 5 mounted on the wiring boards 30, and a plurality of conductive via insulation boards 20 having openings 12 for housing the semiconductor element 5 and connection electrodes buried in vias are alternately laminated and unified into a thin type semiconductor device capable of housing semiconductor elements. Insulation spacers having heat dissipation paths may be inserted between the laminated wiring boards 30 and the conductive via insulation boards 20. Thin type semiconductor elements can be laminated longitudinally, without damaging them, and can be made compact and thin. Uniform heat dissipation from the entire semiconductor device is possible to thereby enable the breakdown prevention of the semiconductor elements and the adaptation of them to high speed operations. |
