发明名称 PASTING METHOD FOR ELECTRONIC PART AND FORMATION METHOD FOR DITCHING ON ADHESIVE TAPE
摘要 <p>PROBLEM TO BE SOLVED: To accurately, easily, and efficiently form, from one surface side of an adhesive tape, a ditch by engraving ditches which are orthogonal each other and are not cut through to the other surface side on the supplied adhesive tape using a ditching means. SOLUTION: Ditch pitches P1 and P2 are formed on an adhesive tape by moving a slider along a guide rail in Y direction by a moving amount P3 between chips 12a of an electronic part 12 while moving it along the guide rail in X direction. Thus, a cutting blade is moved in X-Y direction based on a pre-input data. When the cutting blade is moved in Y direction, a cutting-blade rotary mechanism provided in a cutter holder rotates the cutting blade by 90 deg., cutting the adhesive tape in Y direction as well. Thus, ditches 30a are formed for die (square) or strip (rectangular) in the specified region of the adhesive tape.</p>
申请公布号 JP2001085360(A) 申请公布日期 2001.03.30
申请号 JP19990255822 申请日期 1999.09.09
申请人 LINTEC CORP 发明人 NOGUCHI ISATO;KUROKAWA HIDEJI
分类号 B26D3/08;C09J7/02;H01L21/301;H01L21/67;H01L21/68;(IPC1-7):H01L21/301 主分类号 B26D3/08
代理机构 代理人
主权项
地址
您可能感兴趣的专利