| 摘要 |
PROBLEM TO BE SOLVED: To strongly bond electronic parts to a wiring layer through solder by sequentially bonding a nickel/boron plating layer, palladium-phosphorus plating layer and metal plating layer on the surface of an area where at least the electrodes of the electronic parts in the wiring layer are connected. SOLUTION: In an insulator 1, multiple wiring layers 2 are bonded and formed from the loading part of the upper face to a lower face. The electrodes of a semiconductor device 3 are electrically connected to a part exposed to the loading part of the wiring part 2. The wiring conductor of an outer electric circuit board is electrically connected to a part derived to the lower face of the insulator 1. The wiring layer 2 executes an operation for connecting the electrodes of the loaded semiconductor element to the outer electric circuit. A nickel/boron plating layer 6, a palladium/phosphorous plating layer 7 and a metal plating layer 8 are sequentially bonded to an area where the electrodes of the semiconductor element are connected. The nickel/boron plating layer 6 operates as a layer where the plating layers 7 and 8 are bonded with good adhesion.
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