| 摘要 |
<p>The present invention provides an epoxy resin composition that gives a cured product having rapid curability, excellent fluidity, low moisture absorption and adhesiveness, and a resin encapsulation-type semiconductor device having excellent solder crack resistance, encapsulated with this composition. An epoxy resin composition comprising a blend of (a) an epoxy resin, (b) a compound having two or more phenolic hydroxyl groups on the average in one molecule and (c) a cationic polymerization catalyst for epoxy resin, as the essential components, and a semiconductor device encapsulated with this composition.</p> |
