发明名称 Polyethylen Formmasse mit verbesserter ESCR-Steifigkeitsrelation und Schwellrate, Verfahren zu ihrer Herstellung und daraus hergestellte Hohlkörper
摘要 The invention relates to a polyethylene moulding compound with multimodal molar weight distribution. Said moulding compound is provided with a total density of >/= 0.940 g/cm<3> and an MFI190/5 in the range of 0.01 to 10 dg/min. The inventive moulding compound contains 30 to 60 wt. % of low-molecular ethylene homopolymer A which is provided with a viscosity number VZA in the range of 40 to 150 cm<3>/g. The moulding compound also comprises 30 to 65 wt. % of a high-molecular copolymer B consisting of ethylene and an additional olefin with 4 to 10 C-atoms and having a viscosity number VZB in the range of 150 to 800 cm<3>/g. Said moulding compound further comprises 1 to 30 wt. % of ultrahigh-molecular ethylene homopolymer C which is provided with a viscosity number VZC in the range of 900 to 3,000 cm<3>/g. The invention also relates to a method for producing the moulding compound in a three-step process and to the use thereof for producing hollow bodies.
申请公布号 DE19945980(A1) 申请公布日期 2001.03.29
申请号 DE1999145980 申请日期 1999.09.24
申请人 ELENAC GMBH 发明人 BERTHOLD, JOACHIM;BOEHM, LUDWIG;ENDERLE, JOHANNES-FRIEDRICH;SCHUBBACH, REINHARD
分类号 B65D1/00;B29C49/04;B29D22/00;B29K23/00;B29L22/00;C08F2/00;C08F2/18;C08F4/642;C08F10/00;C08F10/02;C08F110/02;C08J5/00;C08L23/04;C08L23/06;C08L23/16;(IPC1-7):C08L23/06 主分类号 B65D1/00
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