发明名称 |
DECORATING MOLDING METHOD FOR THERMOPLASTIC RESIN MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To easily provide a molding whose protective layer has sufficient physical properties without performing after-coating by adding a photopolymerization initiator to an acrylic copolymer and a compound having a (meth)acryloyl group at a specific ratio to produce a photopolymerizable resin composition. SOLUTION: A photopo1ymerizable resin composition forming a protective layer consists of 40-60 pts.wt. acrylic copolymer, 60-60 pts.wt. compound (wherein, an acrylic copolymer is removed.) having (meth)acryloyl groups of at least three pieces in a molecule and a photopolymerization initiator. In the acrylic copolymer, a (meth)acryloyl group is introduced into the glycidyl group of a side chain and the (meth)acryloyl group of at least one piece is contained in a molecule and glass transition temperature of a main chain is 40-120 deg.C and weight-average molecular weight is 10,000-200,000. Then, a flexible decorating film 25 in which the compoairion is applied and dried to form a protective layer 21 is set in a mold and a thermoplastic material is injected and molded. The surface of a molding is irradiated with ultraviolet rays to cure the protective layer 21. |
申请公布号 |
JPH0957792(A) |
申请公布日期 |
1997.03.04 |
申请号 |
JP19950217542 |
申请日期 |
1995.08.25 |
申请人 |
TOYODA GOSEI CO LTD;MITSUBISHI RAYON CO LTD |
发明人 |
TAKADA RYOICHI;WATARAI HIROSHI;KAWADA TOSHIMICHI;IKEDA HIROTAKE;MITA TAKASHI |
分类号 |
B29C35/08;B29C35/02;B29C45/16;B29K33/00;B29K101/12;B29K105/24;B29L9/00;B32B27/30;B60R13/02;B60R13/04;C08F2/50;C09D4/06;(IPC1-7):B29C45/16 |
主分类号 |
B29C35/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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