| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin material having excellent moldability resistance to solder reflow cracking and to humidity and the like even in the case that copper lead frame is used, and provide electronic part units equipped with elements sealed with the resin material. SOLUTION: The objective epoxy resin forming material for sealing characteristically comprises (A) an epoxy resin bearing 2 or more epoxy groups in one molecule, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler as essential components where (B) the curing agent includes (E) a polycondensate from (a) a compound bearing phenolic hydroxy group, (b) a triazine derivative and (c) a compound bearing aldehyde groups and the softening point of the polycondensate (E) is 50-110 deg.C. The objective electronic part units are equipped with elements sealed with this sealing epoxy resin material.
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