| 摘要 |
A process for profiling solder joints of circuit boards including solder bumps is provided using an arrangement with a thin tape element with length and width dimensions generally corresponding to the length and width dimensions of the ball grid array (BGA) and with a registration portion. Thermal couple probes are positioned on the element at locations corresponding, based on the registration portion, to critical locations of the BGA requiring profiling. The element is disposed underneath the BGA and secured in position with the element in registration with the solder bumps on the BGA and with the plurality of thermal couples connected to the element such that the thermal couples are positioned corresponding to the critical locations requiring profiling. The tape element may be kapton tape. The registration may be provided with a portion of the element having holes, each hole being of a size to go over a solder bump on the BGA.
|
