| 发明名称 |
Laminate and method of manufacture thereof |
| 摘要 |
A fabric material and method of its manufacture suitable for use in electronic packages including chip carriers. High insulation resistance is exhibited when subjected to high temperatures and humidity stress conditions.
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| 申请公布号 |
US6207595(B1) |
申请公布日期 |
2001.03.27 |
| 申请号 |
US19980033505 |
申请日期 |
1998.03.02 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
APPELT BERND K.;BLUMBERG LAWRENCE R.;FOTORNY WILLIAM T.;HAVENS ROSS D.;JAPP ROBERT M.;PAPATHOMAS KOSTAS;OBRZUT JAN;POLIKS MARK D.;RAI AMARJIT S. |
| 分类号 |
B32B5/02;B29B11/16;B29B15/10;D06M15/41;D06M101/00;H01L23/00;H01L23/08;H01L23/14;H05K1/03;(IPC1-7):B32B27/04 |
主分类号 |
B32B5/02 |
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