| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition excellent in flame retardancy, soldering heat resistance, high temperature reliability, moldability and safety, by including a thermosetting resin, a curing agent, and a flame retardant comprising a organic flame retardant as the main component. SOLUTION: This resin composition for sealing semiconductors is obtained by including (A) a thermosetting resin (e.g. epoxy resin, polymaleimide resin), (B) curing agent (e.g. a phenolic resin, an acid anhydride, an amine compound), and (C) preferably 1-20 wt.%, based on the whole resin composition, of a flame retardant comprising an organic flame retardant (e.g. a heterocyclic compound, nitrogen-contg. compound, phosphorus-contg. compound) as the main component. The starting temperature of thermal decomposition of the component C, is preferably >=260 deg.C. It is preferable that the content of chlorine ion in the cured form of this composition is <=200μg per g of the cured form and that the cured form shows flame retardancy equivalent to V-0 in the UL 94 burning test at a thickness of 1/16 inch.
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