| 发明名称 |
Galvanizing solution for the galvanic deposition of copper |
| 摘要 |
The invention relates to a novel galvanizing solution for the galvanic deposition of copper. Hydroxylamine sulfate or hydroxylamine hydrochloride are utilized as addition reagents and added to the galvanizing solution during the galvanic deposition of copper which is used in the manufacture of semiconductors. |
| 申请公布号 |
AU7413600(A) |
申请公布日期 |
2001.03.26 |
| 申请号 |
AU20000074136 |
申请日期 |
2000.08.25 |
| 申请人 |
MERCK PATENT G.M.B.H |
发明人 |
JUNG-CHIH HU;WU-CHUN GAU;TING-CHANG CHANG;MING-SHIANN FENG;CHUN-LIN CHENG;YOU-SHIN LIN;YING-HAO LI;LIH-JUANN CHEN |
| 分类号 |
C25D3/38;C25D7/12;H01L21/28;H01L21/288 |
主分类号 |
C25D3/38 |
| 代理机构 |
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代理人 |
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