| 摘要 |
PROBLEM TO BE SOLVED: To provide a lead frame, in which an external terminal is arranged in a row at the bottom of a package, the surface of each external electrode is positively exposed, and generation of resin flash can be prevented, and to provide a method of resin-sealed type semiconductor device using the same, by constituting the semiconductor device using a frame which can be mounted on a substrate at its bottom side. SOLUTION: In a lead frame for an LGA(land grip array), by connecting respective land lead parts 4 with a resin type 24, sealing resin is injected into a die during resin sealing, the sealing resin is applied not only to the land lead parts 4 but also the regions connected by the resin tape 24, and the entire respective land lead parts 4 are pressed downward with pressure by the injection pressure. Then, since the faces of land electrodes 16 on the land lead parts 4 is bonded on a sealing seat, the sealing resin does not flow into the surfaces of the land electrodes 16. As a result, resin flash is prevented from occurring on the surfaces of the land electrodes 16 of the land lead parts 4. |
