| 摘要 |
PROBLEM TO BE SOLVED: To obtain a halogen-free photosensitive resin composition which does not produce hydrogen bromide as a poison gas in burning and is excellent in heat and moisture resistances, adhesion and flame resistance. SOLUTION: The photosensitive resin composition contains (A) an epoxy acrylate resin, (B) an epoxy resin, (C) a diluent, (D) a curing agent, (E) a curing accelerator, (F) a sensitizer, (G) a phosphagen oligomer and (H) an inorganic filler as essential components. The phosphagen oligomer G is contained by 2-50 wt.% of the amount of the entire resin composition. |
