| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, which can eliminate a dimensional conversion difference and can simplify a manufacturing process by omitting an etching step. SOLUTION: The method for manufacturing a semiconductor device includes steps of forming a resist film 3 on an opening formation region for contact hole or the like, forming an insulating film 4 in a region other than the resist film 3, and removing the resist film 3 to form an opening such as a contact hole 8a in the insulating film 4.
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