发明名称 HEAT CONDUCTIVE DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a heat conductive device for ice manufacture which is excellent in heat conductivity by restraining a dry face from occurring at the liquid film of a water flowing down on a heat conductive plate. SOLUTION: A heat conductive device 1 is equipped with a heat conductive plate 2 having a pipe 8 being meandering while reciprocating in horizontal direction and forming a wall by a plate 2 between the straight sections of a pipe running parallel with each other and its periphery, and a sprinkler 3 sprinkling water and letting it flow down the top end of the heat conductive plate 2. The heat conductive plate 2 is made of aluminum and is manufactured by roll bonding method, and its pipe is circular with one part of the circumferential face rising from the board face. When cooling the liquid film 7 of water flowing down the heat conductive plate 2 by the refrigerant flown through the pipe 8, the liquid film 7 hits upon the pipe 8 and spreads sideways, so it counteracts the contracting force by the surface tension of the liquid film 7, thus preventing the dry face of the liquid film 7 from occurring.</p>
申请公布号 JP2001074344(A) 申请公布日期 2001.03.23
申请号 JP19990250282 申请日期 1999.09.03
申请人 HITACHI LTD 发明人 YANATORI MICHIO;OHIRA AKIYOSHI;SAKANO YOSHITAKA
分类号 F24F5/00;F25C1/06;F25C1/12;(IPC1-7):F25C1/12 主分类号 F24F5/00
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