| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent In and Sn from being evaporated by a method wherein a lid material main body is clad with a solder layer, and a degree of oxidation of a Solder layer surface is detected, and the detected value resting on EPMA (WDX) detection data is set smaller than specified. SOLUTION: A solder foil 31 and a lid material main body 32 are brought into contact with each other between rolls 33 for cladding, and the surface of the solder foil 31 that clads the lid main body 32 is subjected to a cleaning treatment by the use of a roll 34 with a SiC abrasive paper. At this point, the degree of oxidation on the surface of the solder layer is set equal to 150 cps or below on EPMA (WDX) detection data. By this setup, a lid mother material is clad with a solder foil, polished with the roll 34, and punched into a clad lid of prescribed dimensions. By this setup, In and Sn can be effectively prevented from being evaporated. |
