| 摘要 |
PROBLEM TO BE SOLVED: To cope with reduction in pitch of the inner leads of a lead frame by a method wherein an insulation fixing member is jointed to the sides of the inner leads where a plated layer is formed. SOLUTION: A lead frame member 1 is equipped with an outer frame member 2, lead frames 3, and an insulation fixing member 8. A plated layer 6 is formed on a wire bonding region near the upside tips of inner leads 5. Moreover, the insulation fixing member 8 is formed like a corridor, possessed of openings 8a corresponding to the plated layer 6, and jointed to the surfaces of the inner leads 5 where the plated layer 6 is formed. The plated layer 6 formed on the inner leads 5 is so formed as to come out at the openings 8a. By this setup, the inner leads 5 are reinforced, their tips are securely held, and the lead frame member 1 equipped with narrower pitch inner leads can be obtained. |
