PLASMA PROCESSING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing device which is capable of shortening a processing time and moreover contaminating a work less when all the surface of a substrate such as a BGA(Ball Grid Array) substrate is treated. SOLUTION: This device is equipped with a reaction chamber 1 of insulating material and at least a pair of electrodes 2 and 3 which are brought into contact with the outer surface of the reaction chamber 1 confront each other, where plasma generating gas is fed into the reaction chamber 1. An alternating electric field is applied between the electrodes 2 and 3 to generate a glow discharge in the reaction chamber 1 under an atmospheric pressure. In this case, the electrodes 2 and 3 are arranged so as to form an electric line of force along the inner surface of the reaction chamber 1. A blowout opening 4 which blows out a jet of plasma of prescribed width is provided to the reaction chamber 1.