发明名称 MANUFACTURE OF CASTELLATION STRUCTURE OF MULTI-CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method which forms a plurality of castellation conductors each isolated and insulated on the inner peripheral surface of a through-hole of a multi-circuit board. SOLUTION: After a lamination process is completed, an I/O land 15 is printed on the upper surface of a multi-circuit board 11, simultaneously with printing of a castellation conductor 14 over the whole inner peripheral surface of a through-hole 13. After that, intersecting parts of a peripheral part of the through-hole 13 and a diving line 12, i.e., both edge portions in the longitudinal direction of the through-hole 13 are punched-out, the castellation conductor 14 is divided into two parts along the dividing line 12, and the castellation conductor 14 is insulated for each circuit board. I/O land 15 is divided into two parts along the dividing line 12, and the I/O land 15 is insulated for every circuit board. After that, the multi-circuit board 11, the castellation conductor 14 and the I/O land 15 are baked at the same time.
申请公布号 JP2001077507(A) 申请公布日期 2001.03.23
申请号 JP19990248511 申请日期 1999.09.02
申请人 SUMITOMO METAL ELECTRONICS DEVICES INC 发明人 NAKAI TOSHIHIRO;NAKA KATSUHIKO
分类号 H05K3/40;H05K1/02;H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/40
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